Low PIM RF Interconnect Solutions

Short for passive intermodulation, PIM is a type of distortion/noise generated by two or more high power signals interacting with non-linear characteristics in the RF path. Essentially, when two or more high power frequencies exist on the same RF interconnect, there is the chance to form additional frequencies which will raise the noise floor.

Cables, connectors and termination workmanship can all play a role in PIM performance as PIM will occur as the result of non-linear junctions of materials and components. In other words, junctions where current does not increase linearly with voltage.

While PIM is an issue for almost every wireless system, it is more noticeable in cellular applications such as 5G because the frequency bands used are very close to each other. PIM can create interference that limits receive sensitivity, lowering the cellular system’s reliability, data rate, and capacity. Passive intermodulation issues can result in decreased system capacity and data rates and dropped calls.

The need for RF interconnect solutions that can accommodate these critical connections while minimizing PIM will continue to grow.  Ensuring connectors are properly and securely tightened and choosing suitable materials and platings help reduce PIM issues. Next, eliminate any nonlinear contacts within the RF interconnect and any poor electrical contacts. PIM issues can be caused by ferrous materials, loose parts, parts with rough surfaces, oxidation, residual flux, etc. If conductive material is used, particulate on the face of the dielectric or within the interface itself will cause problems and may move directly on the connectors when installed.